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MSV – International Industrial Fair

65th International Industrial Fair

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Field 10.23.9 Packaging materials and packages, packaging machines for the industry - other
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Packung s.r.o.

Our company, Packung s.r.o., specializing in innovative packaging solutions and automation technologies, will be presenting advanced systems for packaging and material handling at this prestigious event. We would be pleased to introduce you in person to the technologies of our partners, SITMA and LANTECH, which significantly enhance the efficiency of packaging processes. At our booth, we will personally present the following technologies: - SITMA Ewrap | an advanced machine for flexible packaging that enables fast and efficient processing of various types of materials, with the ability to adapt to specific customer requirements. More information available on the website www.sitma.cz, https://www.youtube.com/watch?v=bFdL24ZKGuk - LANTECH CASE ERECTOR | an automated line for assembling and sealing boxes, which ensures flawless results at high speeds while minimizing the need for manual labor. More information available on the website https://obaly-optimalizace.cz/balici-stroje/case-erector/, https://www.youtube.com/watch?v=oZ6_r0ptUjI&t=1s At our booth, we will also showcase space-filling technologies for boxes, such as honeycomb paper, fillpack, or bubble-embossed paper. Furthermore, we would like to introduce additional innovative technologies that, based on data knowledge, offer a broader perspective on your logistics strategy. - BOXOLLO.COM | BOXOLLO helps reduce packaging materials, shipping costs, and improve operator efficiency. Calculate the minimal box size on the go, based on the dimensions of individual products. Try the tool, which has been awarded by several independent experts. Watch the video introduction to the project https://www.youtube.com/watch?v=JoETnmC0sxc

Location Pavilion A2 / 011
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